Properties / Thermal
Onset of thermal decomposition (TGA) [°C]
Common test standards: ISO 11358
2 measurements compared
| Experiment | Fungus | Substrate | Density [kg/m³] | Value | Standard / conditions | |
|---|---|---|---|---|---|---|
| Wood–mycelium particles without CNF (100WM) | White-rot fungus (basidiomycete), undisclosed | SPF particleboard particles (spruce/pine/fir) | 600 | 241.9 °C | TGA Hi-Res, N₂, up to 600 °C Sun et al. 2019 |
|
| Pure mycelium (removed from wheat grain composite) · T. versicolor | Trametes versicolor | 225 °C | from PCFC curve Jones et al. 2018 |